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Bearing antifriction layer plating technology development

Date锛2013-8-28 9:36:04

Lining direct plating on metal friction-reducing coating, is easily spread to the lining of tin coating, bearing on the job after a period of time, Tin content in the coating drops to less than 6% (quality). Both lining lining for copper alloy or aluminum based alloys, which contain a certain amount of copper diffusion into the lined Tin and copper generates brittle intermetallic compounds (Cu3Sn). Not only degrade mechanical performance of coating, and destruction of the lining of the structure, to Bush's overall mechanical performance. Methods to resolve the problem is between the linings and friction-reducing underlying a barrier layer of nickel or nickel-base alloy plating (also known as the gate or barrier layer), to contain Tin, spread to the lining.
  1 Tin or lead-tin alloy protective layer in addition to the corrosion of certain things, bearing antifriction layer supplements can also spread during the Tin content, the content of individual components in a relatively stable state. In addition, because of this protective layer does not contain copper, is relatively soft, so Bush can achieve a good break-in requirements early on.
  This paper examining bearing antifriction layer plating process.
  2 development history
  Antifriction coating research started earlier in a foreign country. 1920 by geluoaofu (J.Grooff), electroplating of tin-lead alloys first patent, and used for naval torpedo inside the gas cylinder surface plating, plating used for bearing starting to in the 1940 of the 20th century. In 1952, Schulz (Schults) made in aluminum and Aluminum-silicon (AlSi) alloy plating on lead-free Tin-copper alloy patent. 1953 Choeff (Schoefe) has published summary of bearing using lead-free Tin-copper alloy. In 1976, the Jong-SangKim,Su-ι ι Pyun and Hyo-Geun Lee made "PB-Sn-Cu plating Crystal surface orientation and morphology", paper [7]. In 1980, bee bee (Beebe), copper-containing 2~3% (quality), Tin 9~12% (quality), the remainder being copper alloy plating production process, coating thickness of 15 μg/m. In 1982, Waterman (Waterman) and others on the ternary alloys of copper ion in plating (Cu2+) replacement made a way.



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